June 18 (Reuters) - Intel on Thursday named Seok-Hee Lee executive vice president of its contract chip-manufacturing division ...

Intel (INTC) stock rises as company appoints former SK Hynix CEO Seok-Hee Lee to lead advanced packaging and manufacturing at ...

Intel has appointed Seok-Hee Lee, the former chief executive of memory maker SK hynix and battery maker SK On, as executive ...

As part of the continued evolution of the Intel Foundry strategy, the company is establishing advanced packaging as a focused ...

Intel has appointed former SK Hynix CEO Seok-Hee Lee to a key foundry leadership role. The move underscores Intel's ...

Intel names Seok-Hee Lee EVP of Intel Foundry to lead advanced packaging as it ramps Intel 18A/14A; explore what it means for customers and investors.

Intel has begun production of its most-advanced chip node, bringing the company one step closer to a possible deal to make ...

Intel (INTC) is attempting to reposition itself in the semiconductor value chain by leveraging one of the few areas where it still holds a differentiated capability—advanced packaging. While Taiwan ...

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Advanced packaging has quietly become the make-or-break factor in the AI race. Hyperscalers need to combine chiplets, high-bandwidth memory, and dense interconnects into powerful final packages that ...

Intel has appointed former CEO of SK hynix and SK On Lee Seok-hee as a senior vice president in its foundry business, amid ...