As the core technology used in modern electronics manufacturing, surface-mount technology (SMT) assembly density is increasing, the number of pins is increasing, and the pitch is decreasing. In ...

Ensuring the reliability of multi-die assemblies requires a variety of approaches to detect subsurface defects. Bonds and interconnects are especially problematic and require more inspection ...

DRAM manufacturers continue to demand cost-effective solutions for screening and process improvement amid growing concerns over defects and process variability, but meeting that demand is becoming ...

Inspecting and testing physical evidence is useful, if not necessary, in many product liability cases that involve direct evidence of a specific product defect. From simple to complex cases, a product ...

April 29, 2013. GOEPEL electronic has recently announced several electrical test and inspection capabilities aimed at printed-circuit boards and board-resident programmable devices. The enhanced ...

In addition to conventional ultrasonic testing methods for high-rate aerospace production, Arcadia Aerospace Industries (AAI) specializes in custom solutions for a number of nondestructive testing ...