As the core technology used in modern electronics manufacturing, surface-mount technology (SMT) assembly density is increasing, the number of pins is increasing, and the pitch is decreasing. In ...

DRAM manufacturers continue to demand cost-effective solutions for screening and process improvement amid growing concerns over defects and process variability, but meeting that demand is becoming ...

Wire bonding is widely used in electronic devices, the semiconductor industry, and microelectronics. It enables interconnections between the die and other electronic components in an integrated ...

The areas of semiconductor test, inspection, and related technologies have seen considerable innovation during the second half of 2017. With regard to test, traditional ATE companies introducing new ...

While many articles have been written about cell testing in R&D labs or cell testing during manufacturing in the factory, let’s turn to the topic of cell testing for incoming inspection. This article ...

The industry is investing in more precise and productive inspection and testing to enable advanced packages and eventually, 3D ICs. The next generations of aerospace, automotive, smartphone, and ...

ANAHEIM, Calif.--(BUSINESS WIRE)--National Technical Systems, Inc. (“NTS”), the leading independent provider of qualification testing, inspection, and certification solutions in North America, is ...