Amkor Technology Inc. today unveiled a high-density manufacturing process that it claims changes the way leadframe-based ICs are packaged and assembled. The Chandler, Ariz.-based company’s (nasdaq: ...
3D-ICs are proving a challenge even for designers accustomed to dealing with power and performance tradeoffs, but they are considered an inevitable migration path for leading-edge designs due to the ...
Leidos has released a new study on mental health stigma within the Intelligence Community (IC) and implications for the security clearance investigation process. The research shows that despite ...
IC design houses are hesitant to place orders for mature process manufacturing with foundries, due to the still uncertain market outlook for the second half of this year, according to industry sources ...
A packaging process developed by Amkor Technology of Chandler, Ariz., is being described by the company as the packaging equivalent of a semiconductor move from 200- to 300-mm wafers. The company's ...
SAN DIEGO, April 15, 2021 (GLOBE NEWSWIRE) -- GBT Technologies Inc. (OTC PINK: GTCH) ("GBT” or the “Company”), started research and development of Delta, a new EDA (Electronic Design Automation) ...
The manufacture of automotive ICs will continue to rely mainly on mature process technologies, according to Denise Lee, senior consultant at McKinsey. Speaking at a forum during the ongoing SEMICON ...
Keysight Technologies, Inc. announced that it has signed a memorandum of understanding (MoU) with Xiamen San’an Integrated Circuit Co. Ltd. (San’an-IC) to collaborate on an advanced process design ...
Verification Suite Streamlines IC Design Process Designed specifically for IC designers using hardware-assisted verification platforms, the Emulation Edge verification suite speeds the functional ...
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