A new technical paper titled “Warpage Study by Employing an Advanced Simulation Methodology for Assessing Chip Package Interaction Effects” was published by researchers at Siemens EDA, D2S, and Univ.

IC packaging is a technique for shielding semiconductor equipment from ambient physical damage or degradation by wrapping them in ceramics or polymer packaging materials. There are several varieties ...

I’m not talking about carnival funhouse mirrors, but rather the different options for mirroring symbols, vias, and bond fingers in your IC Package layout. The Allegro Package Designer Plus and SiP ...

Targeting a silicon device for a flip-chip package introduces significant IC and package design complexities throughout the entire product development cycle. This package-die combination must be ...

Advanced IC packaging is a prominent technology highlight of the “More than Moore” arena. At a time when chip scaling is becoming more difficult and expensive at each node, engineers are putting ...

SCOTTSDALE, USA: Advanced packaging of semiconductor chips has emerged as a key enabler in many of today's electronic system products. Put another way, package selection is increasingly important to ...

STMicroelectronics has introduced two miniature IC package types which are less than one millimetre thick. The MSOP8 package, also called TSSOP8 3×3 according to JEDEC standards, is claimed to be 23 ...