EDN

DESIGN TOOLS: IC design flow integrated

Santa Cruz, Calif. — At first glance, the Pilot Design Environment from Synopsys Inc. may sound like a resurrected EDA framework from the late 1980s. But Synopsys claims to be taking a fresh approach ...
EDN

Cobra strikes to reshape IC design flow

Santa Cruz, Calif. – Claiming breakthrough technology that will reshape the nanometer-IC design flow, Magma Design Automation Inc. is preparing to roll out its Cobra technology during the next four ...
Semiconductor Engineering

Design Flow Challenged By 3D-IC Process, Thermal Variation

3D-ICs are proving a challenge even for designers accustomed to dealing with power and performance tradeoffs, but they are considered an inevitable migration path for leading-edge designs due to the ...
Semiconductor Engineering

Boost High-Performance IC Design Flows With Early Interactive Symmetry Checking

In the realm of high-performance IC (integrated circuit) design, symmetry is not just an aesthetic preference—it’s a critical factor for ensuring proper device functionality, especially in analog and ...
Business Wire

UMC and Cadence Collaborate on 3D-IC Hybrid Bonding Reference Flow

“The Cadence 3D-IC flow with the Integrity 3D-IC platform is optimized for use on UMC’s hybrid bonding technologies, providing customers with a comprehensive design, verification and implementation ...
Nasdaq

Cadence Integrity 3D-IC Platform Qualified by Samsung Foundry for Native 3D Partitioning Flow on 5LPE Design Stack

Integrity 3D-IC is Cadence’s next-generation multi-chip design solution, integrating silicon and package planning and implementation with system analysis and signoff to enable system-driven PPA ...
Nasdaq

Ansys 3D-IC Power Integrity and Thermal Solutions Certified for TSMC 3Dblox Reference Flow

Ansys® Redhawk-SC™ and Ansys® Redhawk-SC Electrothermal™ multiphysics power integrity and 3D-IC thermal integrity platforms are certified as compliant with TSMC's 3Dblox standard for 3D-IC design ...
Electronic Design

Reducing IC design effort with easy-to-use reliable digital IC design flow

IROC Technologies faced developing an integrated circuit (IC) - from scratch - with limited internal IC design resources. To meet the aggressive tapeout schedule, IROC needed to feel confident in the ...
Digi Times

Cadence, UMC team up for 22nm analog and mixed-signal IC design flow certification

Cadence Design Systems' analog and mixed-signal (AMS) IC design flow has been certified for United Microelectronics' (UMC) 22ULP/ULL process technologies, according to the companies. This flow ...
Business Wire

UMC and Cadence Collaborate on Analog/Mixed-Signal Flow for 22ULP/ULL Process Technologies

SAN JOSE, Calif. & HSINCHU, Taiwan--(BUSINESS WIRE)--United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) (UMC), a leading global semiconductor foundry, and Cadence Design Systems, Inc. (Nasdaq ...
KLFY News 10

Ansys 3D-IC Power Integrity and Thermal Solutions Certified for TSMC 3Dblox Reference Flow

PITTSBURGH, Oct. 26, 2022 /PRNewswire/ -- Ansys (NASDAQ: ANSS) has collaborated with TSMC to certify that Ansys RedHawk-SC™ and Ansys® Redhawk-SC Electrothermal™ are compliant with TSMC's 3Dblox™ ...