Lidless FCBGA packages maximize PCB real estate by allowing closer spacing between passive components and the flip chip die. Lidless FCBGA packages enable the die to contact with an external heat sink ...
Samsung Electro-Mechanics announced plans to expand the proportion of high-value-added flip chip ball grid array (FCBGA) products, including servers, artificial intelligence (AI), automotive ...
An update on flip chip ball grid array (FCBGA) package development as quality and reliability requirements increase for larger and larger package form factors and approaches that should be taken to ...
Thermal interface materials (TIMs) have been widely adopted for improved thermal dissipation in flip chip ball grid array (FCBGA), flip chip lidded ball grid array (FCLGA) and flip chip pin grid array ...
Samsung Electro-Mechanics (SEMCO) reportedly plans to install a new production line for ABF-based flip chip ball grid array (FCBGA) substrates at its factory site in Vietnam, with investment estimated ...
Bigger . . . faster . . . stronger. It's not only an adage pushing athletes in professional sports. These same attributes are driving electronic flip chip ball grid array (FCBGA) packages (see figure ...
Leading Taiwan IC substrate maker Phoenix Precision Technology (PPT) plans to boost its current monthly flip chip ball-grid array (FCBGA) substrate capacity from 10 million to 24 million chips in 2007 ...
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