An overview of the fundamentals of Finite Element Analysis (FEA) and its importance in aerospace component design. A look at how FEA software enables aerospace engineers to simulate the results of ...

In 2001, IBM patented a method of using a double bump material structure to make a reliable joint between a chip and its package for bump pitch below 150 µm. 1 This invention improved the existing ...

Using novel theoretical and modeling tools such as finite element analysis can greatly accelerate widespread applications in many areas of nanotechnology. Polymer reinforcement using fillers is a ...

Professor of Mechanics, Washington University, St. Louis, Mo. It's easy to construct finite-element models with errors. And it's just as easy to correct them, when you know how. The first step in a ...