MILPITAS, Calif.--(BUSINESS WIRE)--GLOBALFOUNDRIES today accelerated its leading-edge roadmap with the launch of a new technology designed for the expanding mobile market. The company’s 14nm-XM ...

The gate-all-around (GAA) semiconductor manufacturing process, also known as gate-all-around field-effect transistor (GAA-FET) technology, defies the performance limitations of FinFET by reducing the ...

GlobalFoundries today accelerated its roadmap with the launch of a new technology designed for the expanding mobile market. The company’s 14nm-XM offering will give customers the performance and power ...

The next frontier in the electronics industry is the FinFET, a new type of multi-gate 3D transistor that offers tremendous power and performance advantages compared to traditional, planar transistors.

Taiwan Semiconductor Manufacturing Company (TSMC) may be showing off its vision for the future of chip manufacturing technologies beyond 20 nanometers when it unveils its latest research into FinFET ...

In a major industry milestone, Samsung Electronics Co. Ltd. today announced that it has begun producing chips using its latest three-nanometer semiconductor manufacturing process. The process will ...

IBM and Samsung have announced their latest advance in semiconductor design: a new way to stack transistors vertically on a chip (instead of lying flat on the surface of the semiconductor). The new ...

IBM Corp. and Samsung Electronics Co. Ltd. on Tuesday detailed a new transistor architecture that they believe could provide twice the performance of current technology using the same amount of ...

Intel goes to a sub-7 nanometer process in mid-2022. This is when Intel finally gets to EUV (Extreme Ultraviolet). Intel used to be ahead in technology but they are now trying to catch up to TSMC ...