When a chip malfunctions it’s the job of the failure analysis engineer to determine how it failed or significantly deviated from its key performance metrics. The cost of failure in the field can be ...

We all have times when we underperform. When failures happen, most of us are highly motivated to perform better next time. To do that, we need to intelligently understand what went wrong. However, ...

Decapsulation of plastic IC packages in different types and size were performed by wet chemical technique. Studied devices were to use in satellites and going to subject a series of test which require ...

Two expectations informed end-users have of electric motor service centers are reliable best practice repairs and root cause failure analysis (RCFA) to prevent recurring failures. Service centers ...

These developments continue to fuel growing investment into the technology and manufacture of semiconductor devices at both industrial and academic research levels. Improvements in technology, ...

The first step for semiconductor chips is visual inspection using an optical microscope or electrical measurements. 2 Mechanical probing, electron beams, emission microscopy, liquid crystal, etc., are ...

Each phase of a project has unique failure signature patterns. Just like the bathtub curve in Figure 2, we see more “failures” in the initial design, development and early production “ramp up” phase.

They can image a wide range of materials and biological samples with high magnification, resolution, and depth of field, thereby revealing surface structure and chemical composition. Industries like ...

Root cause failure analysis (RCFA) addresses a problem that has appeared in a previously stable environment. Although this technique is most often applied to a production environment, the principles ...