Huntsman Advanced Materials (Basel, Switzerland) reports that it has developed a new epoxy resin system and a novel and cost-efficient compression molding concept. By combining a new fast-cure ...

System-in-Package (SiP) technology has been used for a wide range of electronic devices, but the warpage behavior of the package can be difficult to control and predict due to complex manufacturing ...

In the on-going commitment to reduce weight even further in automotive structures, many OEMs and suppliers are focusing on implementing the best and most cost-effective processing techniques to ...

Today’s fan-out wafer-level packaging (FOWLP) processes use organic substrates composed of epoxy mold compound (EMC) created using a thermal compression process. EMC wafers are a cost-effective way to ...

Here, Klaus Ritter, Head of the Centre of Excellence for Composites at Huntsman Advanced Materials, looks at how the company is helping to optimise the latest out-of-autoclave manufacturing techniques ...