Intel has expanded its Xeon 6 line of processors, adding models 6700/6500 for high-performance cores and edge computing devices to the family. The new Xeon 6 processors feature Performance-cores ...

Artificial intelligence chip startup SiMa Technologies Inc. has unveiled what it says is the first system-on-chip platform that’s specifically designed to handle multimodal AI workloads at the ...

Motorola is preparing a new mobile device for launch. The timing suggests it could be one of the first phones to feature an unannounced Qualcomm processor. The device, with the model number XT2603-1, ...

The rise of Edge AI has largely been born out of increased demand for inference power available need the user, with organizations increasingly seeking to deploy AI algorithms and models onto local ...

Ambarella launched the N1-655 SoC, enabling 12x 1080p video streams with low power consumption and advanced AI processing capabilities. Ambarella, Inc. announced the N1-655 edge GenAI system-on-chip ...

Hailo Technologies Ltd., a startup that specialized in making computer chips for artificial intelligence workloads at the edge, said today it has raised another bumper funding round. It has just ...

Join our daily and weekly newsletters for the latest updates and exclusive content on industry-leading AI coverage. Learn More Advanced Micro Devices announced today the expansion of its Versal ...

The Samsung Galaxy Book 4 Edge is one of the first laptops certified as “Copilot+ Ready” to hit the market. Essentially, this just means the laptop is ready for on-device AI workloads, and is strapped ...

Solution providers are finding new partnership opportunities as a flood of AI chip startups enter the market—but there is risk involved. Fabrizio Del Maffeo was thousands of miles from his company’s ...

SAN FRANCISCO--(BUSINESS WIRE)--BrainChip Holdings Ltd. (ASX: BRN), a leading provider of ultra-low power, high-performance AI technology, ended the 2020 calendar year having made significant strides ...

Stacking chiplets vertically using short and direct wafer-to-wafer bonds can reduce signal delay to negligible levels, enabling smaller, thinner packages with faster memory/processor speeds and lower ...