Electronics Weekly

Sematech qualifies porous low-k for dual damascene

Sematech qualifies porous low-k for dual damasceneJeff Chappell at ElectronicNews OnlineInternational Sematech engineers have qualified a porous, ultra low-k material for dual damascene copper ...
Semiconductor Engineering

Marangoni Effect-Based Under-Layer For A Dual Damascene Via-First Approach

One of the main challenges of a Dual Damascene (DD) via-first process is the control of the Critical Dimensions (CDs) in the lithography of the trenches. The PhotoResist (PhR) thickness presents ...
EDN

FSI joins copper dual damascene process alliance

MINNEAPOLIS–FSI International Inc. said it has signed a cooperative agreement with Novellus Systems Inc. to join the Damascus Alliance. The alliance is a group of semiconductor equipment companies ...
EDN

Sematech Qualifies Porous Low K for Dual Damascene

International Sematech engineers have qualified a porous, ultra low-k material for dual damascene copper processing at 0.13-micron feature sizes using 193nm lithography on 300mm wafers, the consortium ...