Copper-copper bonding is emerging as a pivotal technology in three-dimensional integration, offering a viable pathway towards overcoming the limitations of traditional interconnect methods. By ...

At the National Institute for Fusion Science researchers have introduced a new metallurgical method (brazing technique) for bonding tungsten and copper alloys. They achieved a superior bonding layer ...

System-in-package integrators are moving toward copper-to-copper direct bonding between die as the bond pitch goes down, making the solder used to connect devices in a heterogenous package less ...