Not every die-inspection problem succumbs to emission microscopy. But more of today’s backside challenges are disappearing as CAD navigation software and the microscope join forces. Emission ...

Acoustic microscope imaging is commonly used along with x-ray inspection during semiconductor production and failure analysis to reveal internal flaws such as cracks and voids. Until recently, however ...

The move to multi-die packaging is driving chipmakers to develop more cost-effective ways to ensure only known-good die are integrated into packages, because the price of failure is significantly ...