As we approach the 1.5nm node and beyond, new BEOL device integration challenges will be presented. These challenges include the need for smaller metal pitches, along with support for new process ...
A highly reliable nano-clustering silica (NCS) with low dielectric constant (k<2.3) and high elastic modulus (E=10Gpa) for copper damascene process has been developed by controlling the size and ...
Imec has presented a semi-damascene integration approach for implementing the vertical-horizontal-vertical (VHV) scaling booster – intended to enable 4-track (4T) standard cells. The semi-damascene ...
Virtual fabrication is used to evaluate the performance of interconnects (line and via resistance, capacitance, etc.) across pitches compatible with either EUV single exposure or SADP for three ...
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