Princeton physicists have discovered an abrupt change in quantum behavior while experimenting with a three-atom-thin insulator that can be easily switched into a superconductor. The research promises ...
Copper (Cu) redistribution layer (RDL) technology is used to interconnect chips in various high current Wafer Level Packaging (WLP) applications. Typically, Cu RDLs with thicknesses of 5-9 µm and ...
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