Scientists in the US have created a tiny silicon chip that can perform mathematical ...
MIT researchers have designed silicon structures that can perform calculations in an electronic device using excess heat ...
MIT engineers use heat-conducting silicon microstructures to perform matrix multiplication with >99% accuracy hinting at ...
Modern winter jackets are also a testament to centuries-old physics and cutting-edge materials science.
University of Houston researchers have developed a new way to make heat flow in ...
UCLA researchers identify a metal with ~3× the heat conduction of copper, offering a potential leap in cooling for chips, AI accelerators, and next-gen electronic systems.
Buildings lose considerable heating and cooling energy through their windows, so window coatings with low thermal ...