Business Wire

OIF Releases Co-Packaging Framework Implementation Agreement

FREMONT, Calif.--(BUSINESS WIRE)--OIF, the global industry forum accelerating market adoption of advanced interoperable optical networking solutions, today announced the release of a framework ...
CRN

IBM Research Hails ‘Co-Packaged Optics’ As Breakthrough Chip Technology For AI Tasks

“The resulting growth of LLMs … is requiring exponential growth in high-speed connections between chips and data centers,” IBM Research engineer John Knickerbocker said. IBM Research has developed ...
Semiconductor Engineering

Advanced Packaging Depends On Materials And Co-Design

Multi-die assemblies offer significant opportunities to boost performance and reduce power, but these complex packages also introduce a number of new challenges, including die-to-RDL misalignment, ...
Business Wire

OIF Launches Co-Packaging Framework Implementation Agreement Project

FREMONT, Calif.--(BUSINESS WIRE)--OIF, the global industry forum accelerating market adoption of advanced interoperable optical networking solutions, today announced the start of the Co-Packaging ...