Add a highly integrated RF and baseband chipset and ready-to-go-wireless module to the rapidly expanding list of components vying for use in the many Bluetooth products under development by OEMs ...
SHENZHEN, China--(BUSINESS WIRE)--Fibocom (Stock Code: 300638), a leading global provider of IoT (Internet of Things) wireless solution and wireless communication modules, releases its latest 5G LGA ...
Houston, Tex. — Texas Instruments has teamed-up with Ember Corp. to launch a microcontroller and networking chipset module for the ZigBee wireless sensing and control market. TI provides its ...
Sierra Wireless Announces New 5G LPWA HL7900 Module Integrating Sony’s Altair ALT1350 Chipset Powering next-gen LPWA solutions with an ultra-low power 5G cellular+ module for IoT February 21, 2023 ...
Keysight has introduced a high-speed, 16-channel PXIe digital stimulus/response module with a parametric measurement unit (PMU). The module provides fast and flexible RF chipset test emulation and ...
The rapid diversification and expansion of data center workloads driven by AI is reshaping system requirements, heightening the need for purpose-built solutions that optimize for power, efficiency, ...
The ESM-2740 SOM-ETX module employs an Intel 855GME chipset that features an Extreme Graphics 2 controller with support for DVMT 2.0 and up to 64 MB of VGA memory. Supporting CRT/LVDS displays, the ...
Fibocom to be first in providing engineering samples of 5G module based on MediaTek chipset platform
Fibocom, a leading global provider of IoT (Internet of Things) wireless solution and wireless communication modules, releases its latest 5G LGA module FG360 during the CES 2021 event. The module is ...
Powering next-gen LPWA solutions with an ultra-low power 5G cellular+ module for IoT Building on the success of Sierra Wireless’ existing HL78 Series LPWA modules, the HL7900 with its ALT1350 chipset ...
LPDDR-based SOCAMM2 chipset, including new Voltage Regulators and SPD Hub, supports AI data center performance scaling in a low-power, high-bandwidth, compact module form factor First in a planned ...
SAN JOSE, Calif., April 22, 2026--(BUSINESS WIRE)--Rambus Inc. (NASDAQ: RMBS), a premier chip and silicon IP provider making data faster and safer, today announced a SOCAMM2 (Small Outline Compression ...
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