In the rapidly evolving landscape of automotive electronics, traditional monolithic design approaches are giving way to something more flexible and powerful—chiplets. These modular microchips, which ...
Chiplet PHY simulator addresses the effects of forward clocking with single-ended signaling and higher bit error rate on die-to-die interconnect performance of ...
The global chip market has seen a significant increase in demand for high-performance chips due to the rapid growth of the automotive industry. This growth is primarily driven by the adoption of ...
What are the challenges of incorporating testing and chiplets? What is a typical test configuration for testing chiplets? 1. Keysight’s M800 series bit-error-ratio testers (BERTs) support NRZ and PAM4 ...
Siemens’ Xpedition Substrate Integrator provides co-design prototyping and planning of 2.5/3D chips.
Why co-optimization is needed when designing 2.5D and 3D chips. The tools provided by Siemens for 2.5D and 3D chip design and packaging. The latest high-performance chips often employ 2.5D and 3D chip ...
Finding the right tools to represent a project idea or carry out a construction job remains an ongoing challenge for architecture and design professionals. While software for drafting, 3D modeling, ...
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