Cadence's new Chiplet Spec-to-Packaged Parts partner ecosystem reduces engineering complexity and accelerates time to market ...
Introduces support for the latest interconnect standards, including Universal Chiplet Interconnect Express™ (UCIe™) 2.0 and Open Compute Project Bunch of Wires (BoW). Enhances Keysight’s EDA standards ...
Intel’s optical compute interconnect chiplet is expected to revolutionize high-speed data processing for AI infrastructure. SANTA CLARA, Calif.--(BUSINESS WIRE)--What’s New: Intel Corporation has ...
Plug-and-play chiplets are a popular goal, but does UCIe 2.0 move us any closer to that becoming a reality? The problem is that the current drivers of the standard are not after interoperability in ...
As AI and ML infrastructures, data centers, networking, telecom, cloud, and edge computing continue to evolve, the demand for modular and scalable system integration is accelerating. The AlphaCHIP1600 ...
Oct. 23, 2024 — A new IDTechEx report, “Chiplet Technology 2025-2035: Technology, Opportunities, Applications,” highlights the transformative potential of chiplets. It predicts the market will reach ...
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