KLAC rides 70% systems revenue surge on advanced packaging and AI chip demand, eyes mid-teen growth in 2026 despite margin ...
Arteris, Inc. has announced the launch of Magillem Packaging, a new software aimed at simplifying and accelerating the chip design process, particularly for advanced technologies in AI and edge ...
The chip manufacturing industry can be quite complex, and that’s normal. After all, there are multiple factors that go into the performance of a SoC, making it a success or directly ruining a good ...
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Intel looks beyond silicon, outlines breakthroughs in atomically-thin 2D transistors, chip packaging, and interconnects at IEDM 2024
Today, the Intel Foundry Technology Research team announced technology breakthroughs in 2D transistor technology using beyond ...
Apple Inc.’s upcoming M5 line of Mac chips will be made using Taiwan Semiconductor Manufacturing Co.’s three-nanometer N3P process, 9to5Mac reported today. The publication attributed the information ...
Designed for nanometer-scale silicon ICs, a new wire-bond chip-packaging process–called Pad on I/O–by chip manufacturer LSI Logic (Milpitas, CA) places bond pads directly on active copper/low-K ...
Broadcom Inc. today detailed a new chip packaging technology, XDSiP, that makes it possible to create processors by stacking multiple silicon dies atop another. XDSiP is short for eXtreme Dimension ...
The A20 chip widely expected to debut in the iPhone 18 Pro and folding iPhone will take advantage of a new packaging technique, on TSMC's 2nm chip fabrication technology. Rumors about the iPhone 18 ...
Artificial intelligence (AI) is reshaping the semiconductor landscape-both as a fast-growing end market and as a catalyst for innovation across mobile, automotive, networking, industrial and beyond.
Also announce tool certification for TSMC N3C process and initial collaboration on TSMC’s newest A14 technology SAN JOSE, Calif.--(BUSINESS WIRE)-- Cadence (Nasdaq: CDNS) today announced it is ...
TL;DR: Apple has ordered next-gen M5 chips from TSMC for iPad Pro and Macs, with production in 2H 2025. The M5 chips will use TSMC's 3nm process and SoIC technology for better thermal management, with ...
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