Intel presented its sophisticated packaging solutions, namely EMIB (Embedded Multi-Die Interconnect Bridge) and Foveros. The company also introduced the Meteor Lake processor which incorporates ...

SANTA CLARA, Calif. — Intel Corp. has developed a packaging technology that embeds a processor die into a specialized, pc-board-like package, getting rid of solder bumps and much of the interconnect ...

Unlike traditional heatsink/fan CPU coolers that continue to grow in size, the HEX 1.0 is built to meet today's high-performance computing needs in a much smaller form factor, which allows consumers ...

Intel has revealed that it's experimenting with direct CPU water cooling, where an Intel CPU package has a waterblock built onto it to remove as much heat as possible from the chip. The company has ...

During Intel's Architecture Day briefing they teased a new interconnect technology, which aims to replace EMIB as their go to for linking and even stacking devices on a package. Intel has made great ...

Samples of the new Intel Core i9-14900KS CPU look like they're making their way into people's hands already, as the forthcoming new flagship chip has been spotted in the rankings for the stability ...

Intel's next-generation Lunar Lake CPUs are still in the ovens inside of their labs, but now we're hearing about the new Core Ultra 5 238V processor with 32GB of LPDDR5X on-package memory. If you ...

Given its recent manufacturing troubles, a resurgent AMD, an incursion from Qualcomm, and Apple’s shift from customer to competitor, it’s been a rough few years for Intel’s processors. Computer buyers ...

Allocating CPU resources in Hyper-V has always been somewhat simplistic. Through the Hyper-V Manager, administrators are able to allocate virtual processors to individual virtual machines (VMs). The ...