Silicon Semiconductor

Preventing liquid cross-contamination in semiconductor manufacturing

Producing high-purity wafers via the CMP process is a critical application and the halting of harmful slurry-DIW ...
EDN

Lam says new platen controls CMP processes within 2 mm of wafer’s edge

FREMONT, Calif.–Lam Research Corp. here today introduced a new platen for its 200-mm wafer chemical mechanical planarization (CMP) system designed to extend reliable control of polishing processes ...
Business Wire

Applied Materials Releases the Industry’s Most Advanced, Productive CMP Platform – the Reflexion GT

TOKYO--(BUSINESS WIRE)--Applied Materials, Inc. today raised CMP * technology to a new level while lowering system cost of ownership (CoO) with the launch of its Applied Reflexion ® GT system for ...
AZOM

Using White Light Interferometry to Characterize CMP Processes

Electronic and computer processors with a higher speed need smaller features for integrated circuits (IC), which also need smoother and smaller substrate surfaces. Chemical mechanical polishing (CMP) ...
AZOM

Using 3D Optical Profiling for Full-Field Hotspot Detection

Chemical mechanical polishing (CMP) – also known as planarization – has long been the most commonly employed technique for smoothing and flattening wafer surfaces during the fabrication of ...
EDN

Applied, Ebara, Novellus to debut low-cost CMP tools

SAN JOSE, Calif.–Responding to an outcry over the soaring cost of chemical mechanical polishing (CMP) technology, several chip-equipment vendors are readying new tools that are said to bring down the ...
Optics

Plessey partners with Axus Technology to deliver monolithic microLED displays

Plymouth, UK -- Plessey, an embedded technologies developer at the forefront of microLED technology for the augmented reality (AR) and display markets, announces a partnership with Axus Technology ...