PHILADELPHIA--(BUSINESS WIRE)--Dow Electronic Materials, a business unit of The Dow Chemical Company (NYSE:DOW), today introduced its new IKONIC™ polishing pad platform, bringing to market Dow’s most ...

PHILADELPHIA--(BUSINESS WIRE)-- Following the introduction of its IKONIC™ chemical mechanical planarization (CMP) polishing pad platform in late 2012, Dow Electronic Materials, a business unit of The ...

Dow Electronic Materials, a unit of U.S. chemical kingpin The Dow Chemical Company ( DOW), has launched the first chemical mechanical planarization (CMP) polishing pads from its new IKONIC 2000 and ...

SANTA CLARA, Calif.--(BUSINESS WIRE)--Applied Materials, Inc. today announced its innovative Applied DuraPad ™ CMP polishing pad technology for 200mm chemical mechanical planarization (CMP) systems.

AURORA, Ill., Oct. 20, 2010 (GLOBE NEWSWIRE) -- Cabot Microelectronics Corporation (Nasdaq:CCMP), the world's leading supplier of chemical mechanical planarization (CMP) polishing slurries and growing ...

CMP is an integral part of the semiconductor chip manufacturing process enhancement process. Since the concept of CMP polishing applications was introduced by Walsh et al. in 1965, CMP process ...

New York, Aug. 02, 2023 (GLOBE NEWSWIRE) -- Reportlinker.com announces the release of the report "Chemical Mechanical Polishing Global Market Report 2023" - https ...

Fujifilm is expanding its chemical-mechanical planarization (CMP) polishing agent production in Japan to meet the rising demand for AI chips in Asia. This expansion will increase production by 30% and ...

In semiconductor manufacturing, the chemical mechanical polishing (or CMP) step is used to planarize, or create a level topography, between each layer of the interconnect structure as the device is ...

Dow Electronic Materials, a unit of U.S. chemical kingpin The Dow Chemical Company (DOW), has launched the first chemical mechanical planarization (CMP) polishing pads from its new IKONIC 2000 and ...