PHILADELPHIA--(BUSINESS WIRE)--Dow Electronic Materials, a business unit of The Dow Chemical Company (NYSE:DOW), today introduced its new IKONIC™ polishing pad platform, bringing to market Dow’s most ...

AURORA, Ill., Oct. 20, 2010 (GLOBE NEWSWIRE) -- Cabot Microelectronics Corporation (Nasdaq:CCMP), the world's leading supplier of chemical mechanical planarization (CMP) polishing slurries and growing ...

SANTA CLARA, Calif.--(BUSINESS WIRE)--Applied Materials, Inc. today announced its innovative Applied DuraPad ™ CMP polishing pad technology for 200mm chemical mechanical planarization (CMP) systems.

Thomas West Inc. (TWI) introduced a hard chemical mechanical planarization (CMP) pad today that will put the small, privately owned Sunnyvale, Calif.-based company up against Rodel Inc., a company ...

HILLSBORO, OR--(Marketwired - May 23, 2013) - Rapidly increasing customer demand for NexPlanar's advanced semiconductor CMP pads has necessitated a significant capacity expansion in both the U.S. and ...

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WILMINGTON, Del., Oct. 16, 2025 /PRNewswire/ -- Qnity, DuPont (DD)'s Electronics business, a premier technology solutions leader across the semiconductor value chain, today announced the signing of a ...

SAN JOSE, Calif. &#151 Rohm and Haas Electronic Materials (R&H) has expanded its efforts in the chemical mechanical planarization (CMP) pad arena. R&H announced two additions to its IC1000 pad line, ...

BANGALORE, India, Jan. 8, 2024 /PRNewswire/ -- CMP Pads Market is Segmented by Application (300mm Wafer, 200mm Wafer), by Type (Hard Pad, Soft Pad). The Global CMP Pads Market Size is expected to ...

Chemical Mechanical Planarization (CMP) is a critical process in the semiconductor, LED wafer, and hard disk manufacturing industry and is used to achieve the substrate wafer's required planarity.