Resonac is looking for development partners to establish a new debonding process, as well as to market the new temporary bonding film. In the front-end and back-end processes of advanced ...

Together with a broad portfolio of K&S solutions, ASTERION™-TW will debut at the SEMICON China Trade Show – Hall N3, Booth #3431 – in Shanghai, from March 25, 2026 through March 27, 2026. Please ...

Introducing New Solutions to Address Emerging Assembly Challenges. SINGAPORE, March 24, 2026 /PRNewswire/ -- Kulicke and Soffa Industries, Inc. ("K&S", "Company") today announced ...

Flip-chip bonding is the process of bonding on-chip electrodes to printed circuit board (PCB) electrodes using Au bumps. The bond strength influences the circuit’s conductivity directly, without the ...

Injection-molded liquid silicone rubber (LSR) is used in the manufacture of many goods, from medical devices to cookware to electronics. Many LSR applications require that the silicone be bonded to ...

A new type of 3D-printed adhesive could change how we join materials together. So far, scientists have developed two new methods that can create extremely strong bonds at the pore level, eliminating ...

A new state law calls for the development of a long-term economic development strategy for Connecticut. The timing is right for us to take a close look at the state bonding process. Sound fiscal ...

Bonding the display cover glass and touchscreen directly to the front of an LCD, the G-Bond optical enhancement process increases contrast and improves the display quality of an LCD by reducing ...