Resonac is looking for development partners to establish a new debonding process, as well as to market the new temporary bonding film. In the front-end and back-end processes of advanced ...

Kulicke and Soffa Industries, Inc. (NASDAQ: KLIC) ("K&S" or the "Company"), a global leader in semiconductor assembly solutions and wedge bonding technology, today announced ASTERION™-TW, a new ...

Introducing New Solutions to Address Emerging Assembly Challenges. SINGAPORE, March 24, 2026 /PRNewswire/ -- Kulicke and Soffa Industries, Inc. ("K&S", "Company") today announced ...

Flip-chip bonding is the process of bonding on-chip electrodes to printed circuit board (PCB) electrodes using Au bumps. The bond strength influences the circuit’s conductivity directly, without the ...

Injection-molded liquid silicone rubber (LSR) is used in the manufacture of many goods, from medical devices to cookware to electronics. Many LSR applications require that the silicone be bonded to ...

A new type of 3D-printed adhesive could change how we join materials together. So far, scientists have developed two new methods that can create extremely strong bonds at the pore level, eliminating ...

Bonding the display cover glass and touchscreen directly to the front of an LCD, the G-Bond optical enhancement process increases contrast and improves the display quality of an LCD by reducing ...