SINGAPORE — ST Assembly Test Services Ltd. this week announced availability of a thinner version of its small-thin plastic ball-grid array (STPBGA) package, which reduces the height to 1.2 mm compared ...
Emulation Technology (ET), introduced today two new adapters supporting the Atmel AT45DB011B/021B and AT45DB161B/321DC DataFlash devices packaged in the Chip Scale Ball Grid Array (CBGA) package. ET's ...
An update on flip chip ball grid array (FCBGA) package development as quality and reliability requirements increase for larger and larger package form factors and approaches that should be taken to ...
Electronic devices continue to shrink in size with advancement in chip fabrication technology. Packaging technology has responded with improved formats to present these chips for assembly to PCBs.
The emergence and evolution of any package technology is driven by market trends as experienced by the end application. With the maturation of the mobile market, the trends for Smartphone and other ...
Have you ever wondered how to eliminate internal delamination inside your semiconductor package, or how to reduce warpage of your large ball-grid array (BGA) package to eliminate non-wets during board ...
[Jack Gassett] is developing a new breakout board for an FPGA. The chip comes in a ball grid array (BGA) package which is notoriously difficult to solder reliably. Since he’s still in development, the ...
Over 81% of new digital designs utilize Field Programmable Gate Arrays (FPGAs). With FPGA packages exceeding 1,000 pins, with Ball Grid Array (BGA) solder bumps providing the interconnect, it is ...
TT Electronics subsidiary IRC Inc. now offers a high-speed digital-termination ball-grid-array (BGA) package designed to prevent signal theft in consumer electronics devices. The CHC series’ BGAs are ...
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