With a 10GHz -3dB roll-off point two new reed relays, available from Rhopoint Components, offer an ideal way for switching low level RF signals, and high speed logic. The leadless relays employ a ...
Electronic devices continue to shrink in size with advancement in chip fabrication technology. Packaging technology has responded with improved formats to present these chips for assembly to PCBs.
The ball grid array (BGA) is a surface-mount chip package that is used to mount embedded devices (e.g. microprocessors) by melting balls of solder between the face of the device and the circuit board.
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