The ball grid array (BGA) is a surface-mount chip package that is used to mount embedded devices (e.g. microprocessors) by melting balls of solder between the face of the device and the circuit board.
having to be soldered to the pc board. The sockets come in pitch sizes of 0.80, 1.00, ...
Ironwood Electronics’ CBT-BGA 7010 ball-grid-array (BGA) socket addresses the high-performance requirements involved in testing BGA devices. The stamped spring pin contactor features 26-gram actuation ...
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