The company’s latest system incorporating the Focused Infra-Red (FIR) rework system technology replaces its Lightmaster model. Hands free and semi-automatic, the IR-X400 FIR rework system boasts the ...
BGA soldering is very reliable if done using the correct procedure, so we introduce GA Soldering on PCB board, BGA Inspection and BGA Rework. According to different packaging materials, BGA components ...
Samsung Electro-Mechanics and LG Innotek are focusing on the high-value semiconductor substrate "flip chip ball grid array" (FC-BGA) to diversify their business portfolios. But as Taiwan's TSMC, the ...
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