Traditionally, the packaged integrated circuit (IC) has been much larger than the IC itself because standard packages must also contain the lead-frame and bond wires. That wasn’t an issue for decades ...
FREMONT, Calif. & HSINCHU, Taiwan--(BUSINESS WIRE)--Avalanche Technology, the leader in next generation MRAM technology, and United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) (“UMC”), a ...
How nanogenerators are used to harvest power. How inductive power-transfer systems deliver high power density. What unique applications targeting consumers and the industry at large are leveraging ...
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