CoWoS shortages open the door for Chipzilla’s EMIB The dark satanic rumour mill has manufactured a hell on earth yarn ...

Apple is expected to use TSMC's new 2nm process and SoIC-X (System on Integrated Chip) advanced packaging technology in the second half of 2025, according to new reports. AMD was the first to adopt ...

TL;DR: Apple and Bitmain will lead demand for TSMC's cutting-edge 2nm process node in 2026, with TSMC ramping capacity to 60,000 wafers monthly by Q4. NVIDIA will adopt TSMC's 3nm node for Rubin AI ...

Apple has initiated early-stage discussions with select Indian semiconductor companies to explore the assembly and packaging of iPhone components, marking a potential milestone in India’s growing role ...

Apple is reportedly in early talks with Indian chip manufacturers, specifically CG Semi, for assembling and packaging iPhone ...

Apple Inc. today announced that it will become the first and largest customer of a $2 billion chip packaging facility Amkor Technology Inc. is building in Arizona. The facility will process chips that ...

Apple has begun mass production of its next-generation M5 series chips for key products such as the next-generation Mac and iPad, according to the Korean media outlet ETNEWS. The M5 lineup includes ...

Intel's 14A process node and die-stacking EMIB are the favoured technologies.

As part of new environmental efforts announced on Tuesday, Apple said it will cut down on the material used in iPhone 13's packaging by removing the outer plastic wrap that typically enshrines the ...

The Apple Watch Ultra launches this Friday. While it was already known that it features new packaging (with first reviews already out), we got the chance to take a look at the new box, which includes ...