USI, a global leader in electronic design and manufacturing services, today announced a breakthrough in advanced power semiconductor packaging technology designed for next-generation power solutions.
Nvidia can design a brilliant AI chip. TSMC can etch its transistors at atomic scale. But if there is no room on the advanced ...
Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711) and a ...
APS Files Two U.S. Provisional Utility Patent Applications Supporting Its Agentic AI Platform for Adobe Illustrator and ...
Patent-pending innovations deliver scalable materials building blocks for advanced AI and high-performance computing packaging solutions Wolfspeed, Inc. (NYSE: WOLF), a global leader in silicon ...
Global Unichip Corp. (GUC), the Advanced ASIC Leader, today announced Jotunn8, a next-generation data center AI inference ...
This post may contain links from our sponsors and affiliates, and Flywheel Publishing may receive compensation for actions taken through them. Intel (INTC) is attempting to reposition itself in the ...
ASML (NASDAQ:ASML) reigns supreme in the semiconductor equipment world, holding a virtual monopoly on extreme ultraviolet (EUV) lithography machines essential for crafting the most advanced chips.
SANTA CLARA, Calif., May 03, 2026 (GLOBE NEWSWIRE) -- Applied Materials, Inc. today announced it has entered into a definitive agreement with ASMPT Limited (HKEX: 0522) to acquire its NEXX business, a ...
Amkor Technology (NasdaqGS:AMKR) is committing a planned US$7b investment to expand its advanced packaging campus in Arizona. The company has secured an additional 67-acre parcel in the state to ...
SK hynix unveils iHBM, a new packaging tech with built-in cooling channels to combat heat in next-gen AI memory. This ...
Amkor Technology partners with AMD on advanced chip packaging, targeting $8.5B-$9.5B revenue by 2028 with a new Arizona ...