Siemens announced a new Additive Manufacturing (AM) Process Simulation solution for predicting distortion during 3D printing. The product is fully integrated into Siemens’ end-to-end Additive ...
The optimized component made of glass fiber-reinforced polyamide is represented here within the NX program with a weight-optimized lattice structure. Photo Credit, all images: Naddcon AIM3D GmbH ...
Novel semiconductor technologies are creating complex process flows, which are needed to support the manufacturing of advanced 3D semiconductor structures. It can be helpful to model process flows, ...
The company AnthroTek uses resin 3D printing and fused depostion modeling to reproduce ultra-realistic masks and organs.
However, the real world is messier than a simulation. In practice, conditions typically change due to slight variations or noise in the printing process. So the researchers created a numerical model ...
Paul Compston, CEO and director; Silvano Sommacal, technical lead, Advanced Diagnostics Division; and John Holmes, senior engineer, New Frontier Technologies Shown here is the laser tape placement ...
Today’s 3D integrated circuit (3D-IC) technology is the culmination of 40 years of research in universities and laboratories scattered across the globe. Beginning with dynamic random-access memory ...
Researchers have developed a new laser-based process for 3D printing intricate parts made of glass. With further development, the new method could be useful for making complex optics for vision, ...
The advantages of 3D digital twins when it comes to building chiplet-based designs. The power-, heat-, and noise-related challenges that chiplets present to engineers. New capabilities of Ansys’s ...