VANCOUVER, BC – August 13th, 2025 – Deemos, a pioneering research company at the forefront of generative AI for 3D content, is celebrating a triumphant week at SIGGRAPH 2025, marked by winning the ...
A new technical paper titled “MFIT: Multi-Fidelity Thermal Modeling for 2.5D and 3D Multi-Chiplet Architectures” was published by researchers at University of Wisconsin–Madison, Washington State ...
The next breakthrough to take the AI world by storm might be 3D model generators. This week, OpenAI open sourced Point-E, a machine learning system that creates a 3D object given a text prompt.
In an era where artificial intelligence, autonomous vehicles, and high-performance computing push the boundaries of semiconductor technology, the thermal management of 2.5D and 3D integrated circuits ...
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