Applied Materials, Inc. today announced its breakthrough Applied Producer(R) Eterna(TM) FCVD(TM) (Flowable CVD(1)) system, the first and only film deposition technology capable of electrically ...

The 3D NAND industry is poised to take off. In a research report issued last month, TechNavio said that the rising flash-storage needs at practical price points will compel enterprise clients to ...

Modern semiconductor processes are extremely complicated and involve thousands of interacting individual process steps. During the development of these process steps, roadblocks and barriers are often ...

SK Hynix has successfully developed a 72-layer 256 Gigabit TLC 3D NAND flash chip, the company announced. It will allow one chip to hold 32 Gigabytes of memory. It makes it the most advanced, ahead of ...

Toshiba and Western Digital are now turning out samples of 3D NAND chips with 64 layers of memory cells, marking the next stage in the technology's evolution. The inside of the Toshiba's manufacturing ...

It's been clear for several years that three-dimensional NAND die stacking, in which chip layers are oriented vertically as opposed to horizontal planar structures was the way forward for ...

Vertical scaling is vital to increasing the storage density of 3D NAND. According to imec, airgap integration and charge trap layer separation are the keys to unlocking it. Inside the charge trap cell ...

After some delays and uncertainty in past years, the 3D NAND market is finally heating up. In 2013 and 2014, Samsung was the only vendor participating in the 3D NAND market. Most other suppliers were ...

3D NAND industry is poised to skyrocket. Have you prepared your portfolio accordingly? The 3D NAND industry is poised to take off. In a research report issued last month, TechNavio said that the ...