Several companies are racing each other to develop a new class of 2.5D and 3D packages based on various next-generation interconnect technologies. Intel, TSMC and others are exploring or developing ...
Anthony is a writer who's worked in the games industry for four years. He's a competitive gamer with a soft spot for retro titles. Anthony enjoys speedrunning a few titles, but Simpson's Hit & Run is ...
2.5D/3D integrated circuits (ICs) have evolved into an innovative solution for many IC design and integration challenges. As shown in figure 1, 2.5D ICs have multiple dies placed side-by-side on a ...
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